Integrated circuit failure detection using IR laser

This paper presents unique research efforts related to the use of infrared (IR) laser beams for detecting failures in integrated circuits. The transparency of the silicon substrate of ICs to radiation in the near infrared (NIR) spectrum permits a noninvasive method for imaging the component circuitry of the IC. A laser test fixture consisting of a 1064 nm continuous wave laser, CCD camera, and image acquisition board is used to generate images from flip chip integrated circuits. Multiresolution image processing techniques are then applied to the resulting images to identify potential defects.