Finite element modeling of high power laser diodes

Finite element analysis of heat transfer and residual stress within high power laser diodes is performed. The model addresses both p-side down and p-side up laser diodes mounted on a variety of gold plated diamond heat sinks. In addition, the model is optimized with respect to the dimensions of the diamond film, and the laser diode cavity lengths. Finally, the design and performance of diamond film heat sinks for high performance GaAs and InP laser diodes are discussed. The results demonstrate the superior performance achieved through thermal engineering of the dominant thermal transport path from the laser diode heat source through diamond films to the heat sink.