2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)

The following topics are dealt with: adhesive joints in microwave applications; electrical conductivity of anisotropic chemical adhesives; conductive adhesive fillets for double sided PCBs; solderable conductive pastes; application of adhesives in MEMS, and MOEMS assembly; isotropically conductive adhesives; reliability; epoxy resins for UV laser cure; double-layer no-flow underfill materials and process; encapsulant characterization tools for process setup and failure analysis; low temperature processable core material for embedded inductor; triazine containing polymers for use in integrated optics; fine pitch flip chip on flex interconnection process; stackable package using chip in polymer technology; high volume printing technologies; lamination technique for electronic packaging; laser processing of flexible substrates; all-polymer field effect transistors and organic thin film transistors; ultra-high dielectric constant polymer based composite; and vacuum molded flip chip packaging technology.