Q-factor prediction and optimization of multilayer inductors for RF packaging microsystems using time domain techniques

This paper presents methods using time domain electromagnetic modeling techniques to characterize passive devices in packaging structures. Particularly, the Q of a novel multilayer inductor is predicted. The inductor uses a "hollow ground plane" configuration to increase performance. The modeling techniques employed include dielectric loss modeling to accurately characterize the device. In addition, several optimizations are used in order to speed computation.