52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)

The following topics are dealt with: Ethernet and WDM technology; package electrical characterization; flip chip packaging; solder technology; reliability and test; modules; materials, transceivers and interconnects; power and EM modeling; flip-chip underfills; reliability and stress; integrated and on-chip passives; reliability and integration; package assembly modeling; process development and characterization for high density interconnects; packaging education; low cost optical packaging; dielectric, adhesive and underfill delamination and modeling; wire bonding and interconnections; substrates and dielectrics; failure analysis; RF devices and RF MEMS; interconnect modeling and characterization; electrically conductive adhesives; wafer level processing and test; Pb-free flip chip; Pb-free solder reliability; failure prediction and modeling; chip-scale and wafer-level packaging; high density and 3D interconnects; array interconnect manufacturing technology; Web-based packaging education.