Optimizing portable product recycling through reverse supply chain technology

In preparing to meet the proposed recycling targets in the WEEE directive, several design for environment tools were used. For small, handheld products, only incremental gains could be realized through design changes, leading to the necessity of investigating other approaches. Some of the problems unique to recycling small products are discussed, including the relatively large contribution of the printed wiring board (PWB) assembly. Techniques to recover all sub-fractions of the PWB, even those typically not considered to be recyclable, were investigated. The ability to achieve material recycling of thermoplastics typically used as housings is equally critical. New approaches to the treatment of whole products are becoming available that are capable of a higher recycling rate than separating and submitting whole PWB's to metal smelters. A review of the key enabling technologies is given, including size reduction and separation, wet and dry processing, and developments in chemical recycling. Expertise in these areas is seen as the domain of specialized, regional recyclers, not necessarily the OEM, who must nonetheless be familiar enough with the technologies to choose the best approach. A numerical survey has been developed to measure different recycling process capabilities. Validation of the process capability of existing recycling centers and in pilot studies has shown that a high rate of material recycling can in fact be achieved. Some of the needs and future prospects for a more recyclable electronics industry are provided.