Abstract
This tutorial will provide an overview of advanced interconnect technologies, including dielectric materials, patterning, metallization, CMP, and packaging. New processes will be discussed, such as ultra-low K dielectrics, air-gap structures, low-damage patterning methods, thin barrier and seed layers, refractory metal capping layers, and novel CMP techniques. The effect of these processes on performance and reliability will be briefly described.

Educational Course Subject Areas
Circuits & Devices

Keywords
Low-k dielectric ,  insulator ,  Ultra low-k dielectric ,  Technology node ,  lithographic dimension ,  wafer ,  Barrier layers ,  Diffusion barriers ,  reactive ion etching ,  Dual damascene ,  chemical mechanical polishing ,  plasma enhanced chemical vapor deposition ,  physical vapor deposition ,  Electroplating