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Invited Paper - Modeling RF Window Breakdown: from Vacuum Multipactor to RF Plasma
By Kim, H.C.; Verboncoeur, J.P.; Lau, Y.Y.
This paper appears in: Dielectrics and Electrical Insulation, IEEE Transactions on
Page(s): 774 - 782
Aug. 2007
Volume: 14 Issue: 4

Price: $29

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