Electro-thermal and thermal-mechanical FE analysis of IGBT module with different bonding wire shape

A finite element model which contains one sixth of the IGBT module based on a real test chip of IGBT module is established to investigate the temperature and stress distribution of different shape bonding wire. The finite element (FE) analysis which coupled electro-thermal and thermal-mechanical are conducted using commercial software ABAQUS. The thermal performance and stress distribution of IGBT module with three kinds of bonding wire respectively shape, named Arc-shape, Parabolic shape and Trapezoidal shape are discussed. The results show that the temperature distribution of three kinds of bonding wire is similar, but the stress of bonding wire is quite different. Parabolic shape bonding wire has the minimum stress 76.73 MPa. Trapezoidal shape bonding wire has the maximum stress 106.1 MPa.