Advanced materials with low dielectric properties and highly thermal conductivity

Along with using faster transmission rate (more than 10 Gbps) and higher transmission frequency (more than 28 GHz) for future 5G applications, there are some challenges must overcome. One is the signal transmission loss at high frequency, the best way to solve this problem is developing low dielectric constant (Dk) and low dissipation factor (Df) materials. The other is the thermal dissipating problem that may overcome by using highly thermal conductivity materials. So how to provide a material with low dielectric properties (low Dk/Df) and highly thermal conductivity (high K) simultaneously is very important.