Modular plug-in high performance integrated single-phase inverter

The recent research exercises have targeted the transfer of the sandwich package benefits to application bespoke switch design, including flip-chip and device stacking topology [1]. This work presents the development of a highly integrated power switch, based on 70μm thin IGBTs and diodes rated at 600V/200A along with customized connectors to interface quickly the gate driver, the input, and the load side PCBs. This modular system has been designed with the aim to achieve high performance including the modularity and maintainability of power converter that can be worse in a system integrated into a single package.