Analytical study of transmission characteristics of MSL bonded NSS by dielectric adhesive with different thickness

This paper investigates transmission characteristics of a microstrip line (MSL) with a noise suppression sheet (NSS) when thickness and permittivity of an adhesive between the NSS and the MSL are changed. The MSL based on IEC standard (IEC62333-2) is fabricated, and a transmission characteristic of the MSL attached with a dielectric-adhesive-backed NSS is simulated by a software Agilent's EMpro.