Numerical model with competitively adsorptive mechanism for copper electrodeposition of TSV

The competitive adsorption between suppressor and accelerator is the crucial behavior to achieve void-free filling of TSV during electrodeposition. Convective velocity and potential on the reactive electrode surface are two important factors for adsorption of additives. In this paper, a method of calculating the competitively adsorptive parameter K
_ads
is found to quantize the effect of these factors based on investigating the distribution of potential and convective velocity in via. And a special competitively adsorptive parameter value as threshold value K
₀
is defined to estimate which represents the leading function between suppressor and accelerator in competitive adsorption, and the value of K
₀
is calculated as 1.631×10
^-7
m/s. Furthermore, TSV filling model with diverse diameter is built, and the simulation results are consistent with that of experiment.