High-rate CMP process for large PCB by controlling platen coolant temperature

In printed-circuit-board (PCB) manufacturing process, Chemical mechanical polishing (CMP) is currently replacing conventional chemical etching or mechanical polishing to remove overburdened copper deposit owing to its ability to realize a global planarization. This paper introduces newly developed Oscar-type CMP machine and copper CMP process to polish rectangular PCB with a size up to 510 mm by 510 mm. The effect of platen coolant temperature on removal rate and removal uniformity during copper CMP is studied to achieve high-rate Cu removal.