Development of solderless wire connector for splicing multipair cable

This paper describes the development and laboratory testing of a new high-reliability solderless connector for splicing cable conductors. It includes discussion of the physical parameters which influence the performance of electrical contacts in general. The experimental and analytical techniques which evolved as part of this project permit important reductions in the amount of experimental data required to make reliability and aging predictions, and should be useful in other problems dealing with the appraisal of electrical contacts.