Thermal and thermo-mechanical simulations on high power diode packaging for a typical power adapter

To analyze thermal and thermo-stress behaviors of the diode packaging for high power applications, a global-local scheme through finite element simulations are performed in this study. To derive necessary boundary conditions and to verify the simulation results, thermal experiments are carried out for comparisons. New diode packaging designs are next proposed in this paper and their thermal resistance and structure stress are finally compared with the currently used ones to study the improvements.