Flexible electronic assemblies for space applications

This work describes the development and evaluation of advanced technologies for the integration of electronic devices within membrane polymers. Specifically, investigators thinned silicon die, electrically connecting them with circuits on flexible (liquid crystal polymer (LCP) and polyimide (PI)) circuits, using gold thermo-compression flip chip bonding, and embedding them within the material. The influence of temperature and flexure on the electrical behavior of active embedded assemblies was evaluated. In addition, the long term thermal cycle resistance of the passive daisy chain assemblies was determined within the Mil Std (-55 to +125°C), extreme low #1 (-125 to +85°C), and extreme low #2 (-125 to +125°C) temperature ranges. The results of these evaluations will be discussed, along with the application of this technology for future NASA missions.