Abstract:
Vias in packages and boards, land-grid-array pins, and connector pins introduce significant crosstalk noise in high-speed differential buses. In this paper, we propose an...Show MoreMetadata
Abstract:
Vias in packages and boards, land-grid-array pins, and connector pins introduce significant crosstalk noise in high-speed differential buses. In this paper, we propose an algorithm that minimizes crosstalk noise by optimizing power/ground distribution as well as differential signal assignment. Experimental results demonstrate its high efficiency and significant electrical benefit.
Published in: 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems
Date of Conference: 19-21 October 2009
Date Added to IEEE Xplore: 17 November 2009
ISBN Information:
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