Ultra-thin flexible microcircuit assemblies using thinned die and multilayer thin-film substrates

Ultra-thin, flexible microcircuit assemblies using thinned die (down to 20 mum in thickness) and multilayer, thin film substrates (up to 4 conductor layers (five dielectric layers) at an overall thickness of approximately 10 mum) have been fabricated. Such circuits offer significant promise in many advanced packaging applications such as: biomedical implant and monitoring devices, wearing apparel electronics, conformal antennas and receiver/ transmitter systems, and appliques of all types.