16×16 VCSEL array flip-chip bonded to CMOS VLSI circuit
Krishnamoorthy, A.V.; Goossen, K.W.; Chirovsky, L.M.F.; Rozier, R.G.; Chandramani, P.; Hui, S.P.; Lopata, J.; Walker, J.A.; Dapos;Asaro, L.A.
Photonics Technology Letters, IEEE
Volume 12, Issue 8, Aug 2000 Page(s):1073 - 1075
Digital Object Identifier   10.1109/68.868012
Summary:We report the flip-chip bonding of a 16×16 array of 970-nm vertical-cavity surface-emitting lasers (VCSELs) to an array of silicon CMOS driver circuits. The small-signal bandwidth of a flip-chip bonded VCSEL is in excess of 4 GHz. Individual VCSELs are capable of being modulated by the CMOS circuits at 1 Gb/s. The thermal impedance of the flip-chip bonded VCSELs is 1°C/mW. The measured crosstalk suppression between channels is approximately 20 dB. Simultaneous parallel testing of up to 80 VCSELs at 1 Gb/s per VCSEL is demonstrated

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