Vertical-cavity surface-emitting lasers flip-chip bonded togigabit-per-second CMOS circuits
Krishnamoorthy, A.V.; Chirovsky, L.M.F.; Hobson, W.S.; Leibengath, R.E.; Hui, S.P.; Zydzik, G.J.; Goossen, K.W.; Wynn, J.D.; Tseng, B.J.; Lopata, J.; Walker, J.A.; Cunningham, J.E.; Dapos;Asaro, L.A.
Photonics Technology Letters, IEEE
Volume 11, Issue 1, Jan 1999 Page(s):128 - 130
Digital Object Identifier   10.1109/68.736418
Summary:We describe the first integration of vertical-cavity surface-emitting laser arrays with gigabit-per-second CMOS circuits via flip-chip bonding

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