Invited Paper - Modeling RF Window Breakdown: from Vacuum Multipactor to RF Plasma
Kim, H.C.; Verboncoeur, J.P.; Lau, Y.Y.
Dielectrics and Electrical Insulation, IEEE Transactions on
Volume 14, Issue 4, Aug. 2007 Page(s):774 - 782
Digital Object Identifier   10.1109/TDEI.2007.4286505
Summary: Not Available

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