RF design methodologies bridging system-IC-module design
Mullen, R.A.
Design Automation Conference, 2004. Proceedings of the ASP-DAC 2004. Asia and South Pacific
Volume , Issue , 27-30 Jan. 2004 Page(s): 491 - 498
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Summary: There has been a long-standing need to link the RF design domains into a connected, common design environment. Such a methodology is possible through implementing system-level behavioral models with different levels of abstraction that can be modelled or co-simulated at the IC circuit level. At module or board design, it is possible to link and simulate multiple chips with board-level components and parastics in an RFIC design environment. With today's more complex IC designs that are heading toward nanometer-scaled semiconductor processes, there is a desire to further understand the many subtle physical IC characteristics, such as layout and substrate parasitics, RF transistor models, IR drops, electromigration, elctromagnetics, and modelling of on-chip spiral inductors. Designers have entered into an era where they could benefit from a balance between analog, digital, and DSP design all in a fast and automated RFIC design environment. We present RF design methodologies that can bridge between system, IC, and module design, providing an efficient, thorough design flow using advanced EDA tools.
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