A nanochannel fabrication technique using chemical-mechanical polishing (CMP) and thermal oxidation
Choonsup Lee; Yang, E.H.; Myung, N.V.; George, T.
Nanotechnology, 2003. IEEE-NANO 2003. 2003 Third IEEE Conference on
Volume 2, Issue , 12-14 Aug. 2003 Page(s): 553 - 556 vol. 2
Digital Object Identifier   10.1109/NANO.2003.1230970
Summary:We have developed a new nanochannel fabrication technique using chemical-mechanical polishing (CMP) and thermal oxidation. With this technique, it is possible to control the width, length, and depth of the nanochannels without the need for nanolithography. The use of sacrificial SiO₂ layers allows the fabrication of centimeter-long nanochannels. In addition, the fabrication process is CMOS compatible. We have successfully fabricated an array of extremely long and narrow nanochannels (i.e. 10 mm long, 25 nm wide and 100 nm deep) with smooth inner surfaces.

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