Minimization of passive circuits losses realized on low resistivity silicon using micro-machining techniques and thick polymer layers
Bouchriha, F.; Grenier, K.; Dubuc, D.; Pons, P.; Plana, R.; Graffeuil, J.
Microwave Symposium Digest, 2003 IEEE MTT-S International
Volume 2, Issue , 8-13 June 2003 Page(s): 959 - 962 vol.2
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Summary:In this paper, a novel technological solution using both silicon surface micromachining and thick polymer layer deposition on low resistivity silicon substrate (20 Ω/cm) has been investigated. The proposed structure achieves both a low attenuation level and a high quality factor. The silicon etching into the coplanar slots leads indeed to a noticeable decrease of the losses, whereas filling the gaps with the polymer BCB avoids a degradation of the effective permittivity.

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