UV-LIGA: a promising and low-cost variant for microsystemtechnology
Wenmin Qu; Wenzel, C.; Jahn, A.; Zeidler, D.
Optoelectronic and Microelectronic Materials Devices, 1998. Proceedings. 1998 Conference on
Volume , Issue , 1999 Page(s):380 - 383
Digital Object Identifier   10.1109/COMMAD.1998.791668
Summary:A low-cost surface microstructuring technique is described and examples provided of its recent application. The new technology, UV-LIGA combines depth UV lithographic patterning of very thick photoresists and electrodepositing of structural materials into the patterned resist moulds. Both UV lithography and electrodeposition do not need any expensive or special equipment. Movable three dimensional microstructures with a high aspect ratio can be obtained by combining the UV-LIGA process with a sacrificial layer technique. As an example of the advanced application in microsystems, fabrication of 3D accelerometers has been presented, using titanium as a sacrificial layer and nickel as the structural material

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