1999 Proceedings. 49th Electronic Components and TechnologyConference (Cat. No.99CH36299)

Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Volume , Issue , 1999 Page(s): -
Digital Object Identifier   10.1109/ECTC.1999.776054
Summary:The following topics were dealt with. WDM; underfill processing; embedded passive components; solder reliability; packaging; optoelectronic modules; flip chip packages; electrically conductive adhesives; optical connectors; interconnects; electric connectors; transceivers; multichip packaging; plastic packaging; optical interconnects; delamination; education; and thermomechanical stress

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