Superhydrophobic Silica Thin Films Prepare by Sol-Gel Process for Antistiction of MEMS Devices

  • Download Citations
  • Email
  • Print

Access The Full Text

Sign In:Full text access may be available with your subscription

Forgot Username/Password?Athens/Shibboleth Sign In

Yonghao Xiu  Lingbo Zhu  Hess, D.W.  Wong, C.P. 
Georgia Inst. of Technol., Atlanta 

This paper appears in: High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
Issue Date: 26-28 June 2007
On page(s): 1 - 5
Location: Shanghai
E-ISBN: 1-4244-1253-6
Print ISBN: 1-4244-1253-6
INSPEC Accession Number: 9740280
Digital Object Identifier: 10.1109/HDP.2007.4283582
Date of Current Version: 08 August 2007

Abstract

Based on the theory of superhydrophobicity for low surface energy coatings, we describe a superhydrophobic antistiction silica coating for MEMS devices. The process uses a novel sol-gel process sequence with a eutectic liquid as a templating agent. The eutectic liquid displays negligible vapor pressure and very low melting point (12degC at ambient conditions) to reduce solvent loss during the high speed spincoating process. After a fluoroalkyl silane treatment, superhydrophobicity is achieved on the as-prepared silica thin film. The solvent can be extracted after the gelation and aging processes. Spin speed effect, eutectic liquid:TEOS ratio in the solution were studied in order to optimize the surface roughness to ensure excellent super-hydrophobicity. Comparison of the silica thin films with silicon pillar surfaces showed that superhydrophobicity for the traditional sol-gel derived silica films demonstrated significant improvement, especially under humid conditions. The AFM force curve obtained with a tipless probe showed that the interaction force is greatly reduced on a rough silica superhydrophobic surface. This result offers great potential to reduce stiction failures in MEMS devices.

Available to subscribers and IEEE members.

Available to subscribers and IEEE members.

Available to subscribers and IEEE members.



Indexed by Inspec

© Copyright 2012 IEEE – All Rights Reserved