Review on materials, microsensors, systems and devices forhigh-temperature and harsh-environment applications
Werner, M.R.; Fahrner, W.R.
Industrial Electronics, IEEE Transactions on
Volume 48, Issue 2, Apr 2001 Page(s):249 - 257
Digital Object Identifier   10.1109/41.915402
Summary:The considerable investment in silicon technology has rarely addressed device use in harsh environments such as high temperatures, aggressive media, and radiation exposure. A clear future requirement is to save weight, volume, and reduce costs in “unfriendly” environments like high temperatures. This can be achieved either by cooling systems or by electronic microsystem components suited to withstand high temperatures. The current status of cooling systems, harsh-environment sensors, and microsystems in view of markets, realized devices, material, properties, process maturity, and packaging technologies are reviewed. Possible semiconductor candidates for high-temperature applications are discussed. The main obstacles for the future of high-temperature and harsh-environment microsystems is highlighted

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