A rational formulation of thermal circuit models for electrothermalsimulation. I. Finite element method [power electronic systems]
Jia Tzer Hsu; Vu-Quoc, L.
Circuits and Systems I: Fundamental Theory and Applications, IEEE Transactions on
Volume 43, Issue 9, Sep 1996 Page(s):721 - 732
Digital Object Identifier 10.1109/81.536742
Summary:As the size of the semiconductor devices is getting smaller with
advanced technology, self-heating effects in power semiconductor devices
are becoming important. An electrothermal simulation of complete power
electronic systems that include Si chips, thermal packages, and heat
sinks is essential for an accurate analysis of the behavior of these
systems. This paper presents a rational approach to construct thermal
circuit networks equivalent to a discretization of the heat equation by
the finite element method. Elemental thermal circuit networks are
developed, which correspond to the linear and cubic Hermite elements in
the 1-D case, to the triangular and rectangular elements in the 2-D
case, and to the tetrahedral and cube elements in the 3-D case. These
thermal circuit networks are to be connected to the electrical networks
of power electronic systems to provide complete electrothermal models
that can be conveniently used in any circuit simulator package.
Verification examples are presented to demonstrate the accuracy of the
proposed formulation
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