Very large arrays of flip-chip bonded 1.55-μm photodiodes forspectroscopic monitoring of WDM networks
Goossen, K.W.; Cunningham, J.E.; Zhang, G.; Walker, J.A.
Lasers and Electro-Optics, 1998. CLEO 98. Technical Digest. Summaries of papers presented at the Conference on
Volume , Issue , 3-8 May 1998 Page(s):54 - 55
Digital Object Identifier   10.1109/CLEO.1998.675858
Summary:We have demonstrated and analyzed very large arrays of flip-chip bonded InGaAs/InP photodetectors, in particular paying attention to how their series and shunt resistances affect zero-bias photocurrent and therefore yield for spectrometer applications. Our device design results in very low series resistance of the diode and high photocurrent collection efficiency at zero-bias. It was shown that for an integrated circuit array wherein attention is paid to eliminating resistance between the flip-chip bonding pad and the feedback resistor node, the effect of leaky diodes is nearly eliminated

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