This article discusses optical and IC technologies feasible for use in the development of LAN interfaces based on future IEEE 100-Gigabit Ethernet SMF and MMF standards. SMF approaches using 10-Gb/s and 25-Gb/s WDM, and DWDM WAN technologies are outlined, with the 25-Gb/s approach examined in detail. The MMF approach using 10-Gb/s parallel optics technology is also examined in detail. Future technologies required for high-volume, low-cost 100 Gb/s are previewed.

As part of the IEEE Ethernet Standards development process, the 802.3 HSSG (Higher Speed Study Group) approved 40 Gb/s and 100 Gb/s data rate objectives for the next Ethernet LAN (local area network) standard with formal adoption possible by 2010. Presentations made at the HSSG in support of the technical and economic feasibility of 100 Gb/s are excellent references.

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CHRIS COLE [SM] is a director at Finisar Corp., Sunnyvale, Calif. He received a B.S. in aeronautics and astronautics, and B.S. and M.S. in electrical engineering from the Massachusetts Institute of Technology. At Hughes Aircraft Co. (now Boeing SDC,) and then M.I.T. Lincoln Laboratory, Chris contributed to multiple imaging and communication satellite programs. Later, he consulted on telecom ICs for Texas Instruments' DSP Group and Silicon Systems Inc. (now Teridian.) At Acuson Corp. (now Siemens Ultrasound,) he was one of the architects of the Sequoia coherent imaging ultrasound platform, where he was also director of hardware and software development groups. As a principal consultant with the Parallax Group, he carried out signal processing analysis and product definition for several imaging and communication systems. He is now managing the development of 40-Gb/s and 100-Gb/s LAN and WAN optical transceivers at Finisar (which acquired his previous company, Big Bear Networks.)

DAVID ALLOUCHE is a director of IC engineering at Finisar. He holds a B.S. in electronics from Montpellier University, France. At National Semiconductor he designed mass storage circuits. He then held engineering management roles at Texas Instruments' Mass Storage Division and later, at Philips Semiconductor, he was responsible for disk drive ICs. As director of engineering at Tripath Corp. he was responsible for XDSL IC's. He now manages the development of IC's for 2.5-Gb/s to 100-Gb/s optical transceivers.

FRANK FLENS is a director of transceiver engineering at Finisar. He holds a B.S. in chemical engineering and material science from the University of California, Davis. At Fairchild Semiconductor, he designed under-the-hood automotive electronics. Then at Hewlett-Packard (subsequently Agilent Technologies, now Avago Technologies,) he developed a broad range of optocouplers for commercial, military and space applications. Later he managed the development of MT-RJ and MTP parallel optics products and the 4-Gb/s platform. Frank is now leading the development of high-volume single-channel and parallel optics transceivers.